Odisha inks $3.3 bn chip substrate manufacturing MoU with Intel, 3DGS | Bengaluru News
The project, estimated at around $3.3 billion, will set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region of Odisha Bengaluru: India’s semiconductor ambitions received a major boost after the Odisha govt signed an MoU with Intel and US-based 3DGS on Friday to bring advanced substrate manufacturing technology to the country….
